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暫無看了化學(xué)芯片開封機(jī)Elite Etch Cu 7100的用戶又看了
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RKD Elite Etch蝕刻酸解封裝置集成了許多的工程創(chuàng)新。采用優(yōu)質(zhì)級碳化硅加工的整體式蝕刻頭組件具有優(yōu)異的耐酸性，再加上活性氮?dú)怏w監(jiān)測和凈化系統(tǒng)這一整體的設(shè)計(jì)，降低了開封完成后殘留在蝕刻頭上酸的冒煙情況。選擇單片碳化硅也可以縮短升溫時(shí)間。
蝕刻頭使用低熱質(zhì)量的設(shè)計(jì)。其他制造商使用高熱質(zhì)量設(shè)計(jì)和復(fù)雜可互換的組件如可移動的蝕刻頭插入，具有不可靠的性能特點(diǎn)。我們簡單但有效的設(shè)計(jì)大大減少了蝕刻頭的清洗和周圍堵塞的情況。
設(shè)備限制鼻壓頭是手動下壓，是專為大量的使用所設(shè)計(jì)。鼻壓頭通常縮回，只在安全蓋完全關(guān)閉后延伸。RAM的鼻子垂直運(yùn)動的固定裝置的蝕刻頭從而消除或包或夾具的運(yùn)動。
The Elite Etch Cu 7100 improves upon the design of the Elite Etch 7000 by incorporating a rapid heating and cooling system. Using a thermal exchanger directly contacting the etch head and acid lines， sulfuric acid decapsulation rate is accelerated to reduce overall volume usage. A precise acid temperature combined with a high delivery rate allows decapsulation of copper wired devices with no wire or metallization damage. The specially designed acid heat exchanger can accurately control the acid temperature between 10° and 250° C with flow rates of up to 8 ml per minute. The high acid pulse rates allow for reasonable etch times even at the lowest temperatures.
The Elite Etch Cu features an acid controller etch head which is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process， both for operator safety and convenient acid disposal.
The device hold-down assembly (ram nose) is a pneumatically activated push rod. The ram nose is normally retracted and extends when the safety cover is fully closed. The ram nose secures the sample package and a definition gasket to the etch head， thus eliminating movement of either the package or its fixturing.
RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchange with minimal exposure to residual acid.
| Etcher Unit | Height: 300 mm (13 in) |
|---|---|
| Width: 190 mm (7.5 in) | |
| Depth: 305 mm (12 in) | |
| Bottle Assembly | Height: 254 mm (10 in) |
| Width: 280 mm (11 in) | |
| Depth: 127 mm (5 in) | |
| Weight | Approx. 16 kg (35 lb) |
| Power Source | 90 to 250 VAC， 50 to 60 Hz (4 amp) |
| Acid temp. range | 10° to 250° C |
| Acid temp. set point | 1° C ± 1% of setting |
| Etch cavity (up to) | 22 mm x 22 mm (30 mm diagonal) |
| Choice of Acids | fuming nitric acids， mixed fuming nitric and sulfuric acids， or fuming/concentrated sulfuric acid |
| Acid Mix Ratios | (nitric to sulfuric ratios) 9:1， 6:1， 5:1， 4:1， 7:2， 3:1， 5:2， 2:1， 3:2， 1:1， 1:2， 1:3， 1:4， 1:5 |
| Post Etch Rinse Options | sulfuric acids， fuming nitric acids， mixed acids， or no rinse |
| Etch Times | 1 to 2，400 seconds in 1 second increments (1 seconds to 40 minutes) dynamic (real time) adjustments of etch time |
| Etchant Volume Selection | 1 to 8 ml per minute - for all acids & acid mixes |
| Etch Delivery Functions | pulsed or Reciprocal Etch Acid Pulse (REAP) for lower acid consumption |
| Operator Program Storage | 100 programs stored to nonvolatile memory |
| Warranty | most comprehensive and inclusive warranty in industry (ask for full details) |
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